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DREIDIMENSIONALES ABTASTSYSTEM MIT MULTILINIEN-ARRAYLASER UND DREIDIMENSIONALES ABTASTVERFAHREN MIT MULTILINIEN-ARRAYLASER

Patentnummer:EP3348958B1
IPC Hauptklasse:G01B11/25
Anmelder:BEIJING TENYOUN 3D TECHNOLOGY CO LTD (1)
TENYOUN 3D (TIANJIN) TECH CO LTD (1)
TENYOUN 3D (TIANJIN) TECHNOLOGY CO., LTD (1)
TENYOUN 3D (TIANJIN)TECHNOLOGY CO LTD (1)
TENYOUN 3D TIANJIN TECH CO LTD (1)
テンヨウン サンウェイ(天津)科技有限公司 (1)
北京天远三维科技股份有限公司 (1)
테년 3디 (톈진) 테크놀로지 코.,엘티디 (1)
Erfinder:DU HUA (1)
LI RENJU (1)
YE CHENGWEI (1)
Anmeldung:28.01.16
Patenterteilung:02.08.23
Einspruch bis:02.05.24

Abstract / Hauptanspruch
The present invention provides a multi-line array laser three-dimensional scanning system and a multi-line array laser three-dimensional scanning method, the system performs precise synchronization and logic control of the multi-line array laser three-dimensional scanning system by a programmable gate array FPGA; employs a line laser array as the projection pattern light source, sends trigger signals to a stereoscopic image sensor, a inertial sensor and a line laser array by FPGA; wherein a upper computer receives image pairs taken by the stereoscopic image sensor, and codes, decodes as well as performs a three-dimensional reconstruction for the laser line array patterns in the image pairs, performs a three-dimensional reconstruction for the feature points on the surface of the measured object, and matches and aligns the three-dimensional feature points at different times; the system predicts and corrects the matching calculation by employing a hybrid sensing technology, which registers and stitches the time domain laser three-dimensional scanning data, meanwhile evaluates the error level in real time and feeds it back to an error feedback controller to obtain an adjustment instruction. Thereby the system performs a laser three-dimensional scanning with low cost, high efficiency, high reliability and high accuracy.


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