| A method with increased throughput for measuring positions of structures on a substrate is disclosed. The substrate is taken from a load port of a metrology machine and is placed immediately in a stage of the metrology machine. At least two measurement loops are carried out, wherein a first measurement loop is started at a time when a substrate temperature is different from the temperature at the stage, and at least one second measurement loop is started at a time after the first measurement loop when the substrate temperature is different from the temperature at the stage. A model is used to calculate from the measured data, taken while there is a temperature mismatch between the stage and the substrate, a real grid of positions of structures on the substrate, corresponding to a situation where the temperature of the stage matches the temperature of the substrate. |
