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FORMMESSVORRICHTUNG

Patentnummer:EP3598058B1
IPC Hauptklasse:G01B5/28
Anmelder:TOKYO SEIMITSU CO LTD (1)
Erfinder:KIMURA HIROAKI (1)
MASUTA HIKARU (1)
SEKIMOTO MICHIHIRO (1)
TAKANASHI Ryo (1)
Anmeldung:18.03.16
Patenterteilung:04.05.22
Einspruch bis:04.02.23

Abstract / Hauptanspruch
The present invention has for object to efficiently use data acquired by roundness measurement for surface roughness measurement to reduce a measurement workload and improve measurement efficiency and the like. To achieve this object, measurement conditions in surface roughness measurement are set on the basis of data on a measuring object acquired by roundness measurement.


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