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Encapsulated fan cap probe

Patentnummer:US10690475B2
IPC Hauptklasse:G01B000714
Anmelder:United Technologies Corporation (0)
One Financial Plaza, Hartford, CT 06101, US
Erfinder:
Anmeldung:23.02.17
Offenlegung:23.02.17
Patenterteilung:23.06.20

Abstract / Hauptanspruch
Disclosed is a probe including a housing; a plurality of axially stacked caps disposed within the housing, the plurality of stacked caps including an inner cap and an outer cap, a probe sensor fixedly disposed between the inner cap and an axial bottom of the housing, and an electronic lead connected to the probe sensor and axially extending through the plurality of caps to an exterior of the probe.

US10690475B2


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