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Anmelder = KLA-Tencor Corporation


Erteilte Patente in der Einspruchsfrist

(DE B,C: 3 Monate nach Erteilung; EP B,C: 9 Monate nach Erteilung)

Patentschrift
Erteilung (Frist)
Anmelder
Titel der Erfindung (Arbeitstitel)
US10190868B2
29.01.19 (12)
Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing
KLA-Tencor Corporation
US10197389B2
05.02.19 (19)
Approaches in first order scatterometry overlay based on introduction of auxiliary electromagnetic fields
KLA-Tencor Corporation
US10215693B2
26.02.19 (40)
Infrared spectroscopic reflectometer for measurement of high aspect ratio structures
KLA-Tencor Corporation
US10215560B2
26.02.19 (40)
Method for shape classification of an object
KLA-Tencor Corporation
US10215559B2
26.02.19 (40)
Metrology of multiple patterning processes
KLA-Tencor Corporation
US10234280B2
19.03.19 (63)
Reflection symmetric scatterometry overlay targets and methods
KLA-Tencor Corporation
US10234271B2
19.03.19 (63)
Method and system for spectroscopic beam profile metrology including a detection of collected light according to wavelength along a third dimension of a hyperspectral detector
KLA-Tencor Corporation
US10288415B2
14.05.19 (120)
Critical dimension uniformity monitoring for extreme ultra-violet reticles
KLA-Tencor Corporation
US10295342B2
21.05.19 (127)
System, method and computer program product for calibration of metrology tools
KLA-Tencor Corporation
US10317198B2
11.06.19 (146)
Three-dimensional mapping of a wafer
KLA-Tencor Corporation
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