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Three-dimensional shape measurement apparatus and three-dimensional shape measurement method | Verfahren und Vorrichtung für dreidimensionale Formvermessung | APPAREIL ET PROCÉDÉ DE MESURE TRIDIMENSIONNELLE

Patentnummer:EP2492633B1
IPC Hauptklasse:G01B001106
Anmelder:OMRON CORPORATION (0)
Kyoto, JP
Erfinder:
Anmeldung:27.10.11
Offenlegung:25.02.11
Patenterteilung:06.03.19

Abstract / Hauptanspruch
A three-dimensional shape measurement apparatus is provided that calculates the height of solder accurately. An approximation surface of a wiring pattern is prepared for an inspection block prior to the application of solder (S22). Furthermore, an approximation surface of lands is prepared for an inspection block prior to the application of solder (S23). Then, based on the prepared approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands, an offset, that is, the distance between the approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands is calculated (S24). Then, the calculated offset is stored in a RAM or the like (S25). Then, after the application of solder, the stored offset is read out, and the height of the solder is calculated.

EP2492633B1


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