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Europäisches Patentamt

Metrology of multiple patterning processes

Patentnummer:US10215559B2
IPC Hauptklasse:G01B001100
Anmelder:KLA-Tencor Corporation (0)
One Technology Drive, Milpitas, CA 95035, US
Erfinder:
Anmeldung:09.10.15
Offenlegung:16.10.14
Patenterteilung:26.02.19

Abstract / Hauptanspruch
Methods and systems for evaluating the performance of multiple patterning processes are presented. Patterned structures are measured and one or more parameter values characterizing geometric errors induced by the multiple patterning process are determined. In some examples, a primary, multiple patterned target is measured and a value of a parameter of interest is directly determined from the measured data by a Signal Response Metrology (SRM) measurement model. In some other examples, a primary, multiple patterned target and an assist target are measured and a value of a parameter of interest is directly determined from the measured data by a Signal Response Metrology (SRM) measurement model. In some other examples, a primary, multiple patterned target is measured at different process steps and a value of a parameter of interest is directly determined from the measured data by a Signal Response Metrology (SRM) measurement model.

US10215559B2


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