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A sensor in a moulded package and a method for manufacturing the same | Sensor in einer geformten Verpackung und Herstellungsverfahren dafür | Capteur dans un emballage moulé et son procédé de fabrication

Patentnummer:EP2224218B1
IPC Hauptklasse:G01D000524
Anmelder:
Erfinder:
Anmeldung:25.02.09
Offenlegung:25.02.09
Patenterteilung:28.11.18

Abstract / Hauptanspruch
The flow sensor or other type of sensor comprises a package (3) having a cylindrical section (6) arranged between an anchor section (5) and a head section (7). The diameter of the anchor section (5) is typically larger than the diameter of the cylindrical section (6), which in turn is typically larger than the diameter of the head section (7). A sensor chip (1) is embedded partially into the package (3), with a sensitive area (2) being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section (6).

EP2224218B1


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