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Europäisches Patentamt

Optimizing the utilization of metrology tools

Patentnummer:US10095121B2
IPC Hauptklasse:G01B001100
Anmelder:KLA-Tencor Corporation (0)
One Technology Drive, Milpitas, CA 95035, US
Erfinder:
Anmeldung:20.01.16
Offenlegung:03.09.14
Patenterteilung:09.10.18

Abstract / Hauptanspruch
Methods and corresponding metrology modules and systems, which measure metrology parameter(s) of a previous layer of a metrology target and/or an alignment mark, prior to producing a current layer of the metrology target, derive merit figure(s) from the measured metrology parameter(s) to indicate an inaccuracy, and compensate for the inaccuracy to enhance subsequent overlay measurements of the metrology target. In an example embodiment, methods and corresponding metrology modules and systems use stand-alone metrology tool(s) and track-integrated metrology tool(s) at distinct measurement patterns to address separately different aspects of variation among wafers.

US10095121B2


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