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Anmelder = KLA-Tencor Corporation


Erteilte Patente in der Einspruchsfrist

(DE B,C: 3 Monate nach Erteilung; EP B,C: 9 Monate nach Erteilung)

Patentschrift
Erteilung (Frist)
Anmelder
Titel der Erfindung (Arbeitstitel)
US9721055B2
01.08.17 (8)
Measurement model optimization based on parameter variations across a wafer
KLA-Tencor Corporation
US9719920B2
01.08.17 (8)
Scatterometry system and method for generating non-overlapping and non-truncated diffraction images
KLA-Tencor Corporation
US9726984B2
08.08.17 (15)
Aperture alignment in scatterometry metrology systems
KLA-Tencor Corporation
US9739719B2
22.08.17 (29)
Measurement systems having linked field and pupil signal detection
KLA-Tencor Corporation
US9739702B2
22.08.17 (29)
Symmetric target design in scatterometry overlay metrology
KLA-Tencor Corporation
US9784987B2
10.10.17 (78)
Apodization for pupil imaging scatterometry
KLA-Tencor Corporation
US9816810B2
14.11.17 (113)
Measurement of multiple patterning parameters
KLA-Tencor Corporation
US9835447B2
05.12.17 (135)
Periodic patterns and technique to control misalignment between two layers
KLA-Tencor Corporation
US9863761B2
09.01.18 (169)
Critical dimension uniformity monitoring for extreme ultraviolet reticles
KLA-Tencor Corporation
US9863756B1
09.01.18 (169)
Line scan spectroscopic white light interferometry for semiconductor inspection and metrology
KLA-Tencor Corporation
US9864173B2
09.01.18 (169)
Systems and methods for run-time alignment of a spot scanning wafer inspection system
KLA-Tencor Corporation
US9869543B2
16.01.18 (176)
Reducing algorithmic inaccuracy in scatterometry overlay metrology
KLA-Tencor Corporation
US9874527B2
23.01.18 (183)
Removing process-variation-related inaccuracies from scatterometry measurements
KLA-Tencor Corporation
US9879977B2
30.01.18 (190)
Apparatus and method for optical metrology with optimized system parameters
KLA-Tencor Corporation
US9885656B2
06.02.18 (197)
Line scan knife edge height sensor for semiconductor inspection and metrology
KLA-Tencor Corporation
US9903711B2
27.02.18 (218)
Feed forward of metrology data in a metrology system
KLA-Tencor Corporation