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Anmelder = KLA-Tencor Corporation


Erteilte Patente in der Einspruchsfrist

(DE B,C: 3 Monate nach Erteilung; EP B,C: 9 Monate nach Erteilung)

Patentschrift
Erteilung (Frist)
Anmelder
Titel der Erfindung (Arbeitstitel)
US9816810B2
14.11.17 (27)
Measurement of multiple patterning parameters
KLA-Tencor Corporation
US9835447B2
05.12.17 (49)
Periodic patterns and technique to control misalignment between two layers
KLA-Tencor Corporation
US9863761B2
09.01.18 (83)
Critical dimension uniformity monitoring for extreme ultraviolet reticles
KLA-Tencor Corporation
US9863756B1
09.01.18 (83)
Line scan spectroscopic white light interferometry for semiconductor inspection and metrology
KLA-Tencor Corporation
US9864173B2
09.01.18 (83)
Systems and methods for run-time alignment of a spot scanning wafer inspection system
KLA-Tencor Corporation
US9869543B2
16.01.18 (90)
Reducing algorithmic inaccuracy in scatterometry overlay metrology
KLA-Tencor Corporation
US9874527B2
23.01.18 (97)
Removing process-variation-related inaccuracies from scatterometry measurements
KLA-Tencor Corporation
US9879977B2
30.01.18 (104)
Apparatus and method for optical metrology with optimized system parameters
KLA-Tencor Corporation
US9885656B2
06.02.18 (111)
Line scan knife edge height sensor for semiconductor inspection and metrology
KLA-Tencor Corporation
US9903711B2
27.02.18 (132)
Feed forward of metrology data in a metrology system
KLA-Tencor Corporation
US9958257B2
01.05.18 (198)
Increasing dynamic range of a height sensor for inspection and metrology
KLA-Tencor Corporation
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